Ultra-thin film EUV resists beyond 20nm lithography

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7972, Issue , 2011, Pages

  Nakagawa, Hiroki ^a   Fujisawa, Tomohisa ^b   Goto, Kentaro ^a   Kimura, Tooru ^b   Kai, Toshiyuki ^b   Hishiro, Yoshi ^a  

^a JSR Micro   (United States)

^b JSR CORPORATION   (Japan)

Author keywords

EUV; Lithography; Multi layer; OHM; Si ARC

Indexed keywords

ETCHING PROCESS; EUV; EUV RESISTS; EXTREME ULTRAVIOLETS; HARD MASKS; INNOVATIVE MATERIALS; MATERIALS AND PROCESS; OHM; RESIST FILMS; RESOLUTION LIMITS; SI-ARC; ULTRA-THIN;

ETCHING; REFINING; ULTRATHIN FILMS;

LITHOGRAPHY;

EID: 79955916496     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.879303     Document Type: Conference Paper

References (12)

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