Hardware/software techniques for DRAM thermal management

Proceedings - International Symposium on High-Performance Computer Architecture

Volumn , Issue , 2011, Pages 515-525

  Liu, Song ^a   Leung, Brian ^a   Neckar, Alexander ^b   Memik, Seda Ogrenci ^a   Memik, Gokhan ^a   Hardavellas, Nikos ^a  

^a NORTHWESTERN UNIVERSITY   (United States)

^b STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

A-THERMAL; BASELINE SYSTEMS; CHIP DENSITY; DRAM CHIPS; HARDWARE AND SOFTWARE; HARDWARE/SOFTWARE; MAIN MEMORY; MEMORY BANDWIDTHS; MEMORY MODULES; MEMORY SYSTEMS; OPERATING TEMPERATURE; PEAK TEMPERATURES; POWER CONSUMPTION; REAL SYSTEMS; REPLACEMENT POLICY; THERMAL EMERGENCIES; THERMAL MANAGEMENT;

CACHE MEMORY; MEMORY ARCHITECTURE; TEMPERATURE CONTROL; TEMPERATURE MEASUREMENT;

DYNAMIC RANDOM ACCESS STORAGE;

EID: 79955901536     PISSN: 15300897     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/HPCA.2011.5749756     Document Type: Conference Paper

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