Systematic studies on reactive ion etch-induced deformations of organic underlayers

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7972, Issue , 2011, Pages

  Glodde, Martin ^a   Engelmann, Sebastian ^a   Guillorn, Michael ^a   Kanakasabapathy, Sivananda ^b   Mclellan, Erin ^b   Koay, Chiew Seng ^b   Yin, Yunpeng ^b   Sankarapandian, Muthmanickam ^b   Arnold, John C ^b   Petrillo, Karen ^b   Brink, Markus ^a   Miyazoe, Hiroyuki ^a   De Silva, E Anuja ^d   Yusuff, Hakeem ^b   Yoon, Kwang Sub ^c   Wei, Yayi ^d   Wu, Chung Hsi J ^b   Varanasi, P Rao ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM   (United States)

^c Samsung   (United States)

^d IBM MICROELECTRONICS   (United States)

Author keywords

Pattern transfer; Planarizing layer; Plasma etch; Spin on carbon; Trilayer; Underlayer; Wiggling

Indexed keywords

PATTERN TRANSFERS; PLANARIZING LAYER; PLASMA ETCH; SPIN ON CARBON; TRILAYERS; UNDERLAYERS; WIGGLING;

DEFORMATION; FLUORINE; MANUFACTURE; MATERIALS; PROGRAMMABLE LOGIC CONTROLLERS;

SUBSTRATES;

EID: 79955881911     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.879442     Document Type: Conference Paper

References (13)

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