Reusable, adhesiveless and arrayed in-plane microfluidic interconnects

Journal of Micromechanics and Microengineering

Volumn 21, Issue 5, 2011, Pages

  Lo, R ^a   Meng, E ^a  

^a University of Southern California ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT MODELING; IN-PLANE; INSERTION RATES; INTEGRATED MICROFLUIDIC SYSTEMS; INTERCONNECT DESIGN; MICRO-FLUIDIC DEVICES; MICROFLUIDIC INTERCONNECTS; MICROMACHINED; NEEDLE INSERTION; OUTER DIAMETERS; PARYLENE C; POLYDIMETHYSILOXANE; PRESSURIZED WATER; RHODAMINE B DYE; SEPTA DESIGN; SINGLE MICROCHANNEL; STRESS DISTRIBUTION; SU-8 CHANNEL;

DESIGN; FLUIDIC DEVICES; MICROCHANNELS; NEEDLES; STRESS CONCENTRATION;

MICROFLUIDICS;

EID: 79955796979     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/21/5/054021     Document Type: Article

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