Characterization of interconnects used in PDMS microfluidic systems

Journal of Micromechanics and Microengineering

Volumn 15, Issue 5, 2005, Pages 928-934

  Christensen, Andrew M ^a   Chang Yen, David A ^a   Gale, Bruce K ^a  

^a Department of Electrical and Computer Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; FLUIDICS; INTERCONNECTION NETWORKS; MICROELECTROMECHANICAL DEVICES; MOLDING; PRESSURE EFFECTS; ROTATION; TESTING;

CORING; MICROCHANNELS; MICROFLUIDIC PACKAGING TECHNIQUE; MICROFLUIDIC SYSTEMS;

PACKAGING;

BONDING; FLUIDICS; MOLDING; PACKAGING; ROTATION; TESTING;

EID: 24144463795     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/5/005     Document Type: Article

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