SCOPUS 정보 검색 플랫폼

Lab on a Chip

Volumn 7, Issue 10, 2007, Pages 1309-1314

Solder-based chip-to-tube and chip-to-chip packaging for microfluidic devices

(5) Murphy, Edward R a Inoue, Tomoya b Sahoo, Hemantkumar R a Zaborenko, Nikolay a Jensen, Klavs F a

a Massachusetts Institute of Technology Cambridge (United States)

b NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

METAL; ORGANIC SOLVENT; SILICON DERIVATIVE;

ARTICLE; HYPERBARISM; METAL BINDING; MICROFLUIDICS; PRIORITY JOURNAL; TEMPERATURE; TUBE;

EID: 34748856709 PISSN: 14730197 EISSN: 14730189 Source Type: Journal
DOI: 10.1039/b704804a Document Type: Article

Times cited : (44)

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