Improving copper electrodeposition in the microelectronics industry

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 2105-2110

  Liu, Y ^a   Wang, J ^a   Yin, L ^b   Kondos, P ^b   Parks, C ^c   Borgesen, P ^b   Henderson, D W ^c   Bliznakov, S ^a   Cotts, E J ^a   Dimitrov, N ^a  

^a BINGHAMTON UNIVERSITY   (United States)

^b Unovis Solutions   (United States)

^c IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ELECTRODEPOSITION; ELECTRONIC COMPONENTS; MICROELECTRONICS INDUSTRY;

COMPUTER NETWORKS;

COPPER;

EID: 51349120730     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550276     Document Type: Conference Paper

References (14)

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