Manipulating stress in Cu/low-k dielectric nanocomposites

Applied Physics Letters

Volumn 98, Issue 14, 2011, Pages

  Murray, Conal E ^a   Besser, Paul R ^b   Ryan, E Todd ^b   Jordan Sweet, Jean L ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CU INTERCONNECT; EIGEN-STRAIN; IN-SITU; K DIELECTRICS; MECHANICAL MODELING; ORGANOSILICATE GLASS; QUANTITATIVE COMPARISON; SUBMICRON;

DIELECTRIC FILMS; MECHANICAL PROPERTIES; NANOCOMPOSITES; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS;

STRESSES;

EID: 79954520411     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3578192     Document Type: Article

References (14)

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14. See supplementary material at http://dx.doi.org/10.1063/1.3578192 E-APPLAB-98-058115 for a top-down schematic of the geometry used in the simulations.