SCOPUS 정보 검색 플랫폼

Applied Physics Letters

Volumn 98, Issue 6, 2011, Pages

Triaxial stress distributions in Cu/low-k interconnect features

(4) Murray, Conal E a Besser, Paul R b Ryan, E Todd b Jordan Sweet, Jean L a

a IBM T J WATSON RESEARCH CENTER (United States)

b IBM MICROELECTRONICS (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BARRIER LAYERS; INTERCONNECT STRUCTURES; LEAST SQUARE; OUT-OF-PLANE; SINGLE DAMASCENE; STRESS TENSORS; STRESS VALUES; TRANSVERSE STRESS; TRIAXIAL STRESS;

STRESS CONCENTRATION; X RAY DIFFRACTION;

LINEWIDTH;

EID: 79951800776 PISSN: 00036951 EISSN: None Source Type: Journal
DOI: 10.1063/1.3549876 Document Type: Article

Times cited : (6)

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