Thermal stress evolution in embedded Cu/low-k dielectric composite features

Applied Physics Letters

Volumn 89, Issue 1, 2006, Pages

  Murray, Conal E ^a   Goldsmith, Charles C ^b   Shaw, Thomas M ^a   Doyle, James P ^a   Noyan, I C ^c  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM MICROELECTRONICS   (United States)

^c Department of Earth and Environmental Sciences   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERCONNECT METALLIZATION; MODULUS MATERIALS; ORGANOSILICATE GLASS (SICOH); SILICON SUBSTRATES;

BOROSILICATE GLASS; COPPER; METALLIZING; RESIDUAL STRESSES; STRESS RELAXATION; THERMAL EXPANSION; THERMAL STRESS; X RAY DIFFRACTION;

DIELECTRIC FILMS;

EID: 33745766427     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2219727     Document Type: Article

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