Heat transfer of an IGBT module integrated with a vapor chamber

Journal of Electronic Packaging

Volumn 133, Issue 1, 2011, Pages

  Yu, Xiaoling ^a   Zhang, Lianghua ^a   Zhou, Enming ^a   Feng, Quanke ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

Author keywords

IGBT module; junction to case thermal resistance; transient temperature; vapor chamber (VC)

Indexed keywords

HEAT PIPES; HEAT TRANSFER; INSULATED GATE BIPOLAR TRANSISTORS (IGBT); THERMAL CONDUCTIVITY; THERMAL LOAD; TWO PHASE FLOW;

BASE PLATES; HEAT SPREADERS; HEAT SPREADING; INSULATED GATE BIPOLAR TRANSISTOR MODULES; JUNCTION-TO-CASE THERMAL RESISTANCE; POWER DENSITIES; THERMAL MODEL; TRANSIENT TEMPERATURE; VAPOR CHAMBER;

HEAT RESISTANCE;

EID: 79952741605     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.4003214     Document Type: Article

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