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Volumn 18, Issue 2-3, 2009, Pages 283-286
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Thermal stress and heat transfer characteristics of a Cu/diamond/Cu heat spreading device
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Author keywords
Diamond; Finite element analysis; Heat spreader; Thermal conductivity; Thermal stress
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Indexed keywords
COPPER;
DIAMOND FILMS;
FINITE ELEMENT METHOD;
HEAT EXCHANGERS;
HEAT TRANSFER;
HEATING EQUIPMENT;
SPREADERS;
STRENGTH OF MATERIALS;
THERMAL CONDUCTIVITY;
THERMAL INSULATING MATERIALS;
THERMAL STRESS;
THERMOANALYSIS;
THERMODYNAMIC PROPERTIES;
THERMOELASTICITY;
CU LAYERS;
DIAMOND;
DIAMOND DEVICES;
DIAMOND LAYERS;
DIAMOND THICKNESS;
EFFECTIVE THERMAL CONDUCTIVITIES;
FINITE ELEMENT ANALYSIS;
FINITE ELEMENT SIMULATIONS;
HEAT SOURCES;
HEAT SPREADER;
HEAT SPREADING;
HEAT TRANSFER CHARACTERISTICS;
DIAMONDS;
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EID: 59649114668
PISSN: 09259635
EISSN: None
Source Type: Journal
DOI: 10.1016/j.diamond.2008.10.059 Document Type: Article |
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Times cited : (29)
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References (8)
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