Fabrication and thermal performance of a thin flat heat pipe with innovative sintered copper wick structure

Conference Record - IAS Annual Meeting (IEEE Industry Applications Society)

Volumn 2, Issue , 2006, Pages 791-796

  Popova, N ^a   Schaeffer, Ch ^a   Avenas, Y ^a   Kapelski, G ^b  

^a LABORATOIRE D ELECTROTECHNIQUE DE GRENOBLE   (France)

^b UNIV GRENOBLE ALPES   (France)

Author keywords

Rectangular grooves in porous sintered wick; Sintered porous structure; Thin flat heat pipe

Indexed keywords

ELECTRONIC STRUCTURE; ELECTRONICS PACKAGING; INFRARED IMAGING; POROUS MATERIALS; SINTERING; THERMAL EFFECTS;

POROUS SINTERED WICKS; SINTERED POROUS STRUCTURES; THERMAL PERFORMANCE; THIN FLAT HEAT PIPES;

HEAT PIPES;

EID: 34948874205     PISSN: 01972618     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IAS.2006.256616     Document Type: Conference Paper

References (9)

1. Faghri Amir - "Heat pipe science and technology", 1995.
2. Chi S.W. - "Heat Pipe Theory and Practice", 1976.
3. Dunn P.D., Reay D.A. - "Heat Pipes", 1994
4. Alexander E.G.Jr. - "Structure property relationships in heat pipe wicking materials", 1972
5. Avenas Yvan - "Etude et realisation de caloducs plats miniatures pour l'intégration en électronique de puissance", 2002
6. N.Popova, C.Schaeffer, G. Kapelski, C. Sarno, S. Parbaud -"Development of micro heat spreaders integrated in 3-dimensionnal stacked electronic packages", ELMA 2005, Bulgaria
7. M.Ivanova, Y. Avenas, O. Karim, G. Kapelski, C. Schaeffer, "Application of sintered metal powder in power electronics cooling" 8th THERMINIC Workshop, October 2002, Madrid
8. Y. Avenas, M. Ivanova, N. Popova, C. Schaeffer, "Thermal analysis of thermal spreaders used in power electronics cooling".
9. N. Popova, C.Schaeffer, G. Kapelski, C. Sarno, S. Parbaud -"Thermal management of stacked 3D electronic packages", PESC 2005, Brezil