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Volumn 49, Issue 6, 2008, Pages 1774-1784

Thermal performance of flat vapor chamber heat spreader

Author keywords

Evaporation and condensation; IC cooling technology; Vapor chamber heat spreader

Indexed keywords

HEAT FLUX; HEAT RESISTANCE; PARAMETER ESTIMATION; SPECIFIC HEAT; TEMPERATURE MEASUREMENT;

EID: 42749097356     PISSN: 01968904     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.enconman.2007.10.024     Document Type: Article
Times cited : (103)

References (7)
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    • Sauciua, I.1    Chrysler, G.2    Mahajon, R.3
  • 2
    • 42749084943 scopus 로고    scopus 로고
    • D. Meh1, Vapor chamber heat sinks eliminate heat spots, [05/2004].
    • D. Meh1, Vapor chamber heat sinks eliminate heat spots, [05/2004].
  • 3
    • 32844465150 scopus 로고    scopus 로고
    • Simple formulas for estimating thermal spreading resistance
    • Simons R.E. Simple formulas for estimating thermal spreading resistance. Electron Cool 10 2 (2004)
    • (2004) Electron Cool , vol.10 , Issue.2
    • Simons, R.E.1
  • 4
    • 0141495195 scopus 로고    scopus 로고
    • Thermal spreading resistance of eccentric heat sources on rectangular flux channels
    • Muzychka Y.S., Culham J.R., and Yovanovich M.M. Thermal spreading resistance of eccentric heat sources on rectangular flux channels. J Electron Pack 125 (2003) 178-185
    • (2003) J Electron Pack , vol.125 , pp. 178-185
    • Muzychka, Y.S.1    Culham, J.R.2    Yovanovich, M.M.3
  • 5
    • 0242489300 scopus 로고    scopus 로고
    • An analytical solution of thermal resistance of cubic heat spreaders of electronic cooling
    • Feng T.Q., and Xu J.L. An analytical solution of thermal resistance of cubic heat spreaders of electronic cooling. Appl Therm Eng 24 (2004) 323-337
    • (2004) Appl Therm Eng , vol.24 , pp. 323-337
    • Feng, T.Q.1    Xu, J.L.2
  • 6
    • 19744367344 scopus 로고    scopus 로고
    • Quantitative thermal performance evaluation of a cost-effective vapor chamber heat sink containing a metal-etched microwick structure for advanced microprocessor cooling
    • Go J.S. Quantitative thermal performance evaluation of a cost-effective vapor chamber heat sink containing a metal-etched microwick structure for advanced microprocessor cooling. Sensors Actuators A 121 (2005) 549-556
    • (2005) Sensors Actuators A , vol.121 , pp. 549-556
    • Go, J.S.1
  • 7
    • 34548222771 scopus 로고    scopus 로고
    • An analytical solution of thermal resistance of vapor chamber heat sink with/without a pillar
    • Hsieh S.-S., Lee R.Y., Hsu C.T., and Chen C.W. An analytical solution of thermal resistance of vapor chamber heat sink with/without a pillar. Energy Convers Manage 48 10 (2007) 2708-2717
    • (2007) Energy Convers Manage , vol.48 , Issue.10 , pp. 2708-2717
    • Hsieh, S.-S.1    Lee, R.Y.2    Hsu, C.T.3    Chen, C.W.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.