The experimental and numerical investigation of a grooved vapor chamber

Applied Thermal Engineering

Volumn 29, Issue 2-3, 2009, Pages 422-430

  Ming, Zhang ^a   Zhongliang, Liu ^a   Guoyuan, Ma ^a  

^a BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS   (China)

Author keywords

Electronics cooling; Grooved structure; Vapor chamber

Indexed keywords

COMPUTER SIMULATION; CONDENSATION; COOLING; COPPER; EXPERIMENTS; HEAT FLUX; HEAT RESISTANCE; HEAT TRANSFER; HEATING EQUIPMENT; LIQUID FILMS; MASS TRANSFER; PHASE INTERFACES; SPREADERS; THERMOANALYSIS; THIN FILMS; TRANSPORT PROPERTIES; TWO DIMENSIONAL;

CONDENSATION SURFACES; COPPER PLATES; CRITICAL HEAT FLUXES; DRY OUTS; ELECTRONICS COOLING; FILLING RATIOS; GROOVED STRUCTURE; HEAT AND MASS TRANSFER MODELS; HEAT DISSIPATIONS; HEAT SOURCES; NUMERICAL INVESTIGATIONS; NUMERICAL MODELS; NUMERICAL SIMULATIONS; RADIAL HEAT TRANSFERS; THERMAL RESISTANCES; THICKNESS DISTRIBUTIONS; THIN LIQUID FILMS; UNIFORM HEAT FLUXES; VAPOR CHAMBER; VAPOR CHAMBERS; VAPOR INTERFACES; VELOCITY FIELDS;

VAPORS;

EID: 55749094130     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2008.03.030     Document Type: Article

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