Effect of thermal annealing on the stress and morphology of deposited nanofilms analyzed using molecular dynamics

Surface and Coatings Technology

Volumn 205, Issue 13-14, 2011, Pages 3865-3871

  Hong, Zheng Han ^a   Lin, Shiang Jiun ^a   Fang, Te Hua ^a   Hwang, Shun Fa ^b  

^a NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

^b NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Annealing radial distribution function (RDF); Intermixing; Molecular dynamics (MD); Recrystallization; Stress; Surface roughness

Indexed keywords

ANNEALED FILMS; ANNEALING PROCESS; AS-DEPOSITED FILMS; ATOMIC LEVEL STRESS; AVERAGE NORMAL STRESS; BEFORE AND AFTER; BIAXIAL STRESS; COOLING PHASE; CU FILMS; INTERFACE MIXING; INTERMIXING; INTERNAL STRESS; MANY-BODY POTENTIALS; MOLECULAR DYNAMICS SIMULATIONS; NANO FILMS; RADIAL DISTRIBUTION FUNCTIONS; RECRYSTALLIZATION; RECRYSTALLIZATIONS; SECOND-MOMENT APPROXIMATIONS; SUBSTRATE TEMPERATURE; THERMAL-ANNEALING; THICKNESS DIRECTION; TIGHT BINDING;

ALUMINUM; ANNEALING; ATOMS; DISTRIBUTION FUNCTIONS; DYNAMICS; METAL ANALYSIS; METALLIC FILMS; MIXING; MOLECULAR DYNAMICS; MORPHOLOGY; RECRYSTALLIZATION (METALLURGY); STRESS ANALYSIS; SURFACE PROPERTIES; SURFACE ROUGHNESS;

COPPER;

EID: 79952490337     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2011.01.066     Document Type: Article

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