Thermal-mechanical optimization of a novel nanocomposite-film typed flip chip technology

Microelectronics Reliability

Volumn 51, Issue 4, 2011, Pages 826-836

  Cheng, Hsien Chie ^a   Hsieh, Kun Yu ^a   Chen, Kuo Ming ^b  

^a FENG CHIA UNIVERSITY   (Taiwan)

^b UNITED MICROELECTRONICS CORPORATION   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING PROCESS; DESIGN OPTIMIZATION; DESIGN PARAMETERS; DESIGN PRACTICE; ELECTRICAL CONDUCTION; FABRICATION PROCESS; FE ANALYSIS; FE-SIMULATION; FLIP CHIP TECHNOLOGIES; GEOMETRY PROPERTIES; MECHANICAL OPTIMIZATION; MECHANICAL PERFORMANCE; METAMODELING; MULTI-CRITERIA DESIGN OPTIMIZATION; NONCONDUCTIVE PASTE; NONLINEAR CONTACT; NOVEL ADHESIVES; OPTIMAL DESIGN; OPTIMIZATION METHODOLOGY; ORIGINAL DESIGN; PACKAGING TECHNOLOGIES; PARAMETRIC FINITE ELEMENTS; RESIDUAL BEHAVIOR; RESPONSE SURFACE METHODOLOGY; SIMULATION METHODOLOGY; THERMAL-MECHANICAL BEHAVIOR;

CHIP SCALE PACKAGES; DESIGN; FINITE ELEMENT METHOD; MATERIALS PROPERTIES; NANOCOMPOSITE FILMS; NANOCOMPOSITES; OPTIMAL SYSTEMS; TECHNOLOGY;

OPTIMIZATION;

EID: 79952184380     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2010.11.007     Document Type: Article

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