SCOPUS 정보 검색 플랫폼

Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers, Series A/Chung-kuo Kung Ch'eng Hsuch K'an

Volumn 24, Issue 4, 2001, Pages 439-451

A study of factors affecting solder joint fatigue life of thermally enhanced ball grid array assemblies

(4) Cheng, Hsien Chie a Chiang, Kuo Ning b Chen, Chao Kuang c Lin, Ji Cheng b

a FENG CHIA UNIVERSITY (Taiwan)

b NATIONAL TSING HUA UNIVERSITY (Taiwan)

c NATIONAL CENTER FOR HIGH PERFORMANCE COMPUTING (Taiwan)

Author keywords

Finite volume weighted averaging technique; Moire interferometry; Parametric finite element analysis; Solder joint reliability; Surface evolver; Thermally enhanced ball grid array

Indexed keywords

FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FINITE VOLUME METHOD; GEOMETRY; INTERFEROMETRY; MATHEMATICAL MODELS; STRAIN MEASUREMENT; STRESS ANALYSIS; THERMAL CYCLING; THERMAL EFFECTS; THERMAL LOAD;

THERMALLY ENHANCED BALL GRID ARRAYS (TEBGA);

SOLDERED JOINTS;

EID: 0035388783 PISSN: 02533839 EISSN: None Source Type: Journal
DOI: 10.1080/02533839.2001.9670641 Document Type: Article

Times cited : (17)

References (15)

1
- 0031337348
- Fatigue life predictions for thermally loaded solder joints using a volume-weighted averaging technique
- (1997) ASME Transactions, Journal of Electronic Packaging , vol.119 , pp. 228-234
- Akay, H.U.¹ Paydar, N.H.² Bilgic, A.³

2
- 0003681520
- University of Minnesota, Geometry Center
- (1994) Surface Evolver Manual
- Brakke, K.A.¹

3
- 0033907410
- On enhancing eutectic solder joint reliability using a 2nd-reflow-process approach
- February
- (2000) IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part A , vol.23 , Issue.1 , pp. 9-14
- Chiang, K.N.¹ Lin, Y.D.² Cheng, H.C.³

4
- 85036410404
- A study of the effects of cyclic thermal stresses on a ductile metal
- (1954) ASME Transactions , vol.76 , pp. 931-950
- Coffin, L.F.¹ Schenectady, N.Y.²

5
- 0029371103
- Thermal deformation analysis of various electronic packaging products by Moire' and microscopic Moire' interferometry
- (1995) ASME Journal of Electronic Packaging , vol.117 , Issue.3 , pp. 185-191
- Han, B.¹ Guo, Y.²

6
- 0031185720
- Finite element modeling of thermal fatigue and damage of solder joints in a ceramic ball grid array package
- (1997) Journal of Electronic Materials , vol.26 , Issue.7 , pp. 814-820
- Hong, B.Z.¹

7
- 0004093302
- McGraw-Hill, New York
- (1997) Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch SMT Assemblies
- Lau, J.H.¹ Pao, Y.H.²

8
- 0029422703
- An integrated model for ball grid array solder joint reliability
- (1995) Structural Analysis in Microelectronic and Fiber Optic Systems, ASME , vol.EEP-12 , pp. 83-89
- Ju, T.H.¹ Chan, Y.W.² Hareb, S.A.³ Lee, Y.C.⁴

9
- 0032002125
- Solder joint reliability of cavity-down plastic ball grid array assemblies
- (1998) Soldering & Surface Mount Technology , vol.10 , Issue.1 , pp. 26-31
- Lee, S.-W.R.¹ Lau, J.H.²

10
- 0003837401
- McGraw-Hill Book Co., Inc., Ny
- (1966) Thermal Stress and Low-Cycle Fatigue , pp. 125-192
- Manson, S.S.¹

11
- 0027752595
- Pack-age-to-board attachment reliability methodology and case study on OMPAC package
- (1993) ASME Advances in Electronic Packaging , vol.EEP-4-1 , pp. 537-543
- Nagaraj, B.¹ Mahalingam, M.²

12
- 0031675181
- BGAs in automotive applications
- January
- (1998) SMT , pp. 50-54
- Pao, Y.H.¹ Jih, E.² Adams, R.³ Song, X.⁴

13
- 0028710559
- A finite element study of factors affecting fatigue life of solder joints
- (1994) ASME Transactions, Journal of Electronic Packaging , vol.116 , pp. 265-273
- Paydar, N.¹ Tong, Y.² Akay, H.U.³

14
- 0004016691
- Reliability analysis for ball grid array/chip scale package
- National Center for High-Performance Computing, Hsinchu, Taiwan
- (1997) Emerging Packaging Technology Workshop'97
- Wu, S.X.¹ Yeh, C.P.²

15
- 0030172955
- Parametric finite element analysis of flip chip reliability
- 2nd Quarter
- (1996) The International Journal of Microcircuits and Electronic Packaging , vol.19 , Issue.2 , pp. 120-127
- Yeh, C.-P.¹ Zhou, W.X.² Wyatt, K.³

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.