Failure analysis of pad-height effects in the fine-pitch interconnection of the anisotropic conductive films

Microelectronics Reliability

Volumn 48, Issue 7, 2008, Pages 1087-1092

  Lin, Chao Ming ^a   Lin, Tzu Chao ^a   Fang, Te Hua ^b   Chao, Kuo Sheng ^a  

^a WUFENG INSTITUTE OF TECHNOLOGY   (Taiwan)

^b NATIONAL FORMOSA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; CONDUCTIVE FILMS; FAILURE ANALYSIS; MATHEMATICAL MODELS; PHOTOACOUSTIC EFFECT; QUALITY ASSURANCE; RAILROAD PLANT AND STRUCTURES; RANDOM PROCESSES; RELIABILITY; RISK ASSESSMENT; SAFETY FACTOR;

ANISOTROPIC CONDUCTIVE FILM (ACF); BOX MODELS; FAILURE PROBABILITIES; GLOBAL FAILURE; OVERALL FAILURE; POISSON; PROBABILITY THEORY;

PROBABILITY;

EID: 48149084958     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.03.014     Document Type: Article

References (11)

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