Contraction stress build-up of anisotropic conductive films (ACFs) for flip-chip interconnection: Effect of thermal and mechanical properties of ACFs

Journal of Applied Polymer Science

Volumn 93, Issue 6, 2004, Pages 2634-2641

  Kwon, Woon Seong ^a   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Anisotropic conductive films (ACFs); Glass transition; Shrinkage; Stress; Thermomechanical properties

Indexed keywords

ANISOTROPY; DEFORMATION; FLIP CHIP DEVICES; GLASS TRANSITION; SHRINKAGE; STRESS ANALYSIS; THERMOMECHANICAL TREATMENT;

ADHESIVE MATRICES; ANISOTROPIC CONDUCTIVE FILMS (ACF); GLASSY MODULUS;

CONDUCTIVE FILMS;

POLYMER SCIENCE;

EID: 4344677675     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/app.20844     Document Type: Article

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