Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives

Microelectronics Reliability

Volumn 45, Issue 7-8, 2005, Pages 1215-1221

  Zhang, Xiaowu ^a   Wong, E H ^a   Rajoo, Ranjan ^a   Iyer, Mahadevan K ^a   Caers, J F J M ^b   Zhao, X J ^b  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b PHILIPS RESEARCH LABORATORIES   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT RESISTANCE; MATERIAL CHARACTERIZATION; NANO-VOLTAMETER; NON-CONDUCTIVE ADHESIVES (NCA);

ADHESIVES; ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; INTERCONNECTION NETWORKS; MATHEMATICAL MODELS; RELIABILITY; SHRINKAGE;

FLIP CHIP DEVICES;

EID: 20344396091     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.07.112     Document Type: Article

References (12)

1. S.X. Wu, Y. Mei, C.P. Yeh, and K.W. Wyatt Process induced residual stresses in ICA joints IEEE Trans CPMT-Part C 19 4 1996 251 256
2. R. Dudek, H. Berek, T. Fritsch, and B. Michel Reliability investigation on conductive adhesive joints with emphasis on the mechanics of the conduction mechanism IEEE Trans CPT 23 3 2000 462 469
3. K.N. Chiang, C.W. Chang, and C.T. Lin Process modeling and thermal/mechanical behavior of ACA/ACF type flip chip packages ASME Trans J. Electron. Packaging 123 4 2001 331 337
4. Yim MJ, Paik KW. Effect of non-conducting filler additions on anisotropic conductive adhesives (ACAs) properties and the reliability of ACAs flip chip on organic substrates. In: Proc 50th Electronic Component Technology Conference, ECTC, Las Vegas, NE, USA, May 2000. p. 899-905.
5. Yang DG, Zhang GQ, Ernst LJ, Caers JFJ, Bressers HJL, Jansen J. Combined experimental and numerical investigation on flip chip solder fatigue with cure-dependent under fill properties. In: Proc 51st Electronic Component Technology Conference, ECTC, Orando, FL, USA, May 2001. p. 919-24.
6. Ernst LJ, van't Hof C, Yang DG, Kiasat MS, Zhang GQ, Bressers HJL, et al. Determination of visco-elastic properties during curing process of under fill materials. In: Proc 50th Electronic Component Technology Conference, ECTC, Las Vegas, NE, USA, May 2000. p. 1070-7.
7. Wong EH, Chan KC, Rajoo R, Lim TB. The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packages. In: Proc. 50th Electronic Component Technology Conference, ECTC, Las Vegas, NE, USA, May 2000. p. 576-80.
8. Caers JFJM, Zhao XJ, Wong EH, Ong CK, Zhang X, Ranjoo R. Prediction of Moisture Induced Failures in Flip Chip on Flex Interconnections with Non-conductive Adhesives. In: Proc 53rd Electronic Components and Technology Conference, ECTC, New Orlean, USA, May 2003. p. 1176-80.
9. Caers JFJM, Kessels FJH. Ageing kinetics for temperature loads of z-conductive adhesive-In-situ monitoring of the contact resistance of heat seal connectors. In: Proc 47th Electronic Components and Technology Conference, ECTC, San Jose, California, USA, May 1997. p. 312-5.
10. Liu J. Use of adhesives for electronics packaging applications-The state of the art. In: Proc Int Conf Micromat '97, Berlin, Germany, 1997. p. 76-83.
11. J. Liu Conductive adhesives for electronics packaging 1999 Electrochemical Publications British Isles
12. X. Zhang, C.Q. Cui, K.C. Chan, E.H. Wong, and M.K. Iyer Analysis of solder joint reliability in flip chip package Int. J. Microcircuits Electron. Packaging 25 1 2002 147 159