Influence of lower current densities on the residual stress and structure of thick nickel electrodeposits

Surface and Coatings Technology

Volumn 205, Issue 12, 2011, Pages 3651-3657

  Pathak, Siddhartha ^a   Guinard, Marion ^a   Vernooij, Martine G C ^a   Cousin, Barbara ^a   Wang, Zhao ^a   Michler, Johann ^a   Philippe, Laetitia ^a  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

Author keywords

Anisotropy; Back scattered electron diffraction (EBSD); Electrodeposition; Indentation; Nickel; Sulfamate bath; Texture

Indexed keywords

BACK-SCATTERED ELECTRON DIFFRACTION (EBSD); COLUMNAR GRAIN; GRAIN SIZE; HARDNESS VALUES; INDENTATION MODULUS; LOW CURRENT DENSITY; NI FILMS; NICKEL ELECTRODEPOSITS; SULFAMATE BATH;

ANISOTROPY; DEPOSITS; ELECTRODEPOSITION; ELECTRON DIFFRACTION; ELECTRON SCATTERING; MECHANICAL PROPERTIES; NICKEL; RESIDUAL STRESSES; TEXTURES;

CURRENT DENSITY;

EID: 79951674780     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2011.01.012     Document Type: Article

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