Microstructure and thermal stability of nickel layers electrodeposited from an additive-free sulphamate-based electrolyte

Surface and Coatings Technology

Volumn 200, Issue 20-21, 2006, Pages 6037-6046

  Rasmussen, Anette A ^a   Møller, Per ^a   Somers, Marcel A J ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

Electrodeposition; Microstructure; Nickel; Thermal stability

Indexed keywords

CURRENT DENSITY; ELECTRODEPOSITION; ELECTROLYTES; HARDNESS; SCANNING ELECTRON MICROSCOPY; SURFACE STRUCTURE; THERMODYNAMIC STABILITY; TRANSMISSION ELECTRON MICROSCOPY; VICKERS HARDNESS TESTING; X RAY DIFFRACTION ANALYSIS;

STRENGTHENING MECHANISMS; SULPHAMATE-BASED ELECTROLYTE;

NICKEL;

CURRENT DENSITY; ELECTRODEPOSITION; ELECTROLYTES; HARDNESS; NICKEL; SCANNING ELECTRON MICROSCOPY; SURFACE STRUCTURE; THERMODYNAMIC STABILITY; TRANSMISSION ELECTRON MICROSCOPY; VICKERS HARDNESS TESTING; X RAY DIFFRACTION ANALYSIS;

EID: 33645811113     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2005.09.019     Document Type: Article

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