Effects of chloride, bromide and iodide ions on internal stress in films deposited during high speed nickel electroplating from a nickel sulfamate bath

Journal of Applied Electrochemistry

Volumn 30, Issue 2, 2000, Pages 231-238

  Tsuru, Y ^a   Nomura, M ^a   Foulkes, F R ^b  

^a KYUSHU INSTITUTE OF TECHNOLOGY   (Japan)

^b UNIVERSITY OF TORONTO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

BROMINE COMPOUNDS; CHLORINE COMPOUNDS; COPPER; CRYSTAL ORIENTATION; CURRENT DENSITY; ELECTROPLATING SOLUTIONS; IODINE COMPOUNDS; NICKEL COMPOUNDS; RESIDUAL STRESSES; STRAIN GAGES; TENSILE STRESS;

HIGH SPEED ELECTROPLATING; NICKEL SULFAMATE;

ELECTROCHEMICAL ELECTRODES;

EID: 0033879080     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1003970925918     Document Type: Article

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