Fabrication of capacitive micromachined ultrasonic transducers via local oxidation and direct wafer bonding

Journal of Microelectromechanical Systems

Volumn 20, Issue 1, 2011, Pages 95-103

  Park, Kwan Kyu ^a   Lee, Hyunjoo ^a   Kupnik, Mario ^a   Khuri Yakub, Butrus T ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

Capacitive micromachined ultrasonic transducer (CMUT); direct wafer bonding; electrical breakdown; local oxidation of silicon (LOCOS); parasitic capacitance; patterning of silicon via oxidation

Indexed keywords

CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER; DIRECT WAFER BONDING; ELECTRICAL BREAKDOWN; LOCAL OXIDATION OF SILICON (LOCOS); PARASITIC CAPACITANCE; PATTERNING OF SILICON VIA OXIDATION;

ACTUATORS; CAPACITANCE; CHEMICAL MECHANICAL POLISHING; CHEMICAL POLISHING; CRYSTALLOGRAPHY; ELECTRIC BREAKDOWN OF LIQUIDS; ELECTROSTATIC ACTUATORS; FABRICATION; NOBELIUM; OXIDATION; PLATES (STRUCTURAL COMPONENTS); POLISHING; SEMICONDUCTING SILICON COMPOUNDS; SILICON OXIDES; SILICON WAFERS; ULTRASONIC EQUIPMENT; ULTRASONIC MEASUREMENT; ULTRASONIC TRANSDUCERS; ULTRASONIC WAVES; ULTRASONICS;

WAFER BONDING;

EID: 79551592405     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2010.2093567     Document Type: Article

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