Effect mechanism of moisture diffusion on LED reliability

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

Volumn , Issue , 2010, Pages

  Wu, Bulong ^a   Luo, Xiaobing ^a,b   Liu, Sheng ^b  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Delamination; High power LED; Moisture diffusion; Reliability; Surface roughness

Indexed keywords

AFM; ATOMIC FORCE MICROSCOPES; CHARACTERISTIC SURFACES; EFFECT MECHANISM; EXPERIMENTAL TEST; FAILURE MECHANISM; HIGH POWER LED; HIGH-POWER; LED CHIPS; MOISTURE CONDITIONS; MOISTURE DIFFUSION; OPTICAL OUTPUT; PERFORMANCE DEGRADATION; PHOSPHOR LAYERS; SIGNIFICANT IMPACTS;

DEGRADATION; DELAMINATION; DIFFUSION; LIGHT EMISSION; MOISTURE; RELIABILITY; STEEL SHEET; SURFACE PROPERTIES; SURFACE ROUGHNESS; SURFACE STRUCTURE;

LIGHT EMITTING DIODES;

EID: 78651345170     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2010.5642833     Document Type: Conference Paper

References (14)

1. J.-W. Park, Y.-B. Yoon and S.-H. Shin, "Joint structure in high brightness light emitting diode (HB LED) packages," Mater. Sci. Eng, Vol. 441, pp. 357-361, (2006).
2. N. Narendran and Y. M. Gu, "Life of LED-Based white light sources," IEEE J-DT, Vol. 1, No. 1, pp. 167-(2005).
3. L.R Trevisanello et al, "Accelerated life test of high brightness light emitting diodes," IEEE Trans-DMR, Vol. 8, No. 2, p. 304-311, (2008).
4. L.R Trevisanello et al, "Thermal stability analysis of high brightness LED during high temperature and electrical aging," Proc. Of SPIE, Vol. 6669 666913, (2007).
5. S. Buso, G. Spiazzi, M. Meneghini, and G. Meneghesso, "Performance degradation of high brightness light diodes under DC and pulsed bias," IEEE Trans-DMR, Vol. 8, No.2, p. 312-322, (2008).
6. C. M. Tan, B. Khai, E. Chen, G. Xu, Y. J. Liu, "Analysis of humidity effects on the degradation of high-power white LEDs," Microelectronics Reliability, Vol. 491, No. 9-1, p. 1226-1230, (2009).
7. J. Z. Hu, L. Q. Yang, W. J. Hwang and M. W. Shin, "Thermal and mechanical analysis of delamination in GaN-based light emitting diode packages," Journal of Crystal Growth, Vol. 288(1),Issue 0022-0248, p. 157-161, (2006).
8. Y. C. Hsu et al, "Failure Mechanisms associated with lens shape of high-power LED modules in aging test," IEEE Trans-ED, Vol. 55, No. 2, p. 570-571, (February 2008 )
9. Moisture/reflow sensitivity classification for nonhermetic solid state surface mount device. JPC/JEDED J-STD-020D, (2007).
10. X. B. Luo, B. L. Wu and S. Liu, "Effect of moist environment on LED module reliability," IEEE Trans-DMR, to be published.
11. X. B. Luo, Y. J. Hui and S. Liu, "Effect of temperature and moisture on LED reliability and its mechanism analysis," Semiconductor Optoelectronics, Vol. 30, No. 3, (June 2009).
12. L. X. Tan, J. L, K. Wang and S. Liu, "Effect of defects on the thermal and optical performance of high-brightness light-emitting diodes," IEEE Trans-EPM, Vol. 32, No. 4, p. 233-240, (October 2009).
13. H. W. Huang et al, "Efficiency enhancement of GaN-Based power-chip LEDs with sidewall roughness by natural lithography," Electrochem. Solid-State Lett, Vol. 10, No. 2, p. 59-62, (2007).
14. C. C. Kao et al, "Light-output enhancement of nanoroughness GaN laserlife-off light-emitting diodes formed by ICP dry etching," IEEE PTL, Vol. 19, No. 11, p. 849-851, (2007).