Failure mechanisms associated with lens shape of high-power LED modules in aging test

IEEE Transactions on Electron Devices

Volumn 55, Issue 2, 2008, Pages 689-694

  Hsu, Yi Cheng ^a   Lin, Yu Kuan ^b   Chen, Ming Hung ^b   Tsai, Chun Chin ^b   Kuang, Jao Hwa ^b   Huang, Sheng Bang ^c   Hu, Hung Lieh ^c   Su, Yeh I ^c   Cheng, Wood Hi ^b  

^a NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^c INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Aging test; High power LED module; Lens shape

Indexed keywords

COMPUTER SIMULATION; ENCAPSULATION; FINITE ELEMENT METHOD; LIGHT EMITTING DIODES; PLASTIC LENSES; STRESS CONCENTRATION; THERMAL AGING; THERMAL EFFECTS;

AGING TEST; HIGH-POWER LIGHT-EMITTING DIODE MODULES; LENS SHAPE;

OPTICAL INSTRUMENT LENSES;

EID: 39749085948     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/TED.2007.911905     Document Type: Article

References (13)

1. S. Nakamura and S. F. Chichibu, Introduction to Nitride Semiconductor Blue Laser Diodes and Light Emitting Diodes. London, U.K.: Taylor & Francis, 2000.
2. P. Maaskant, M. Akhter, J. Lambkin, and L. Considine, "Failure mechanisms associated with the fabrication of InGaN-based LEDs," IEEE Trans. Electron Devices, vol. 48, no. 8, pp. 1822-1825, Aug. 2001.
3. E. F. Schubert, Light-Emitting Diodes. New York: Cambridge Univ. Press, 2006, ch. 11.
4. Y. Lin, D. S. Wuu, K. F. Pan, S. H. Huang, C. E. Lee, W. K. Wang, S. C. Hsu, Y. Y. Su, S. Y. Huang, and R. H. Horng, "High-power GaN-mirror-Cu light-emitting diodes for vertical current injection using laser liftoff and electroplating techniques," IEEE Photon. Technol. Lett., vol. 17, no. 9, pp. 1809-1811, Sep. 2005.
5. H. Luo, J. K. Kim, E. F. Schubert, J. Cho, C. Sone, and Y. Park, "Analysis of high-power packages for phosphor-based white-light-emitting diodes," Appl. Phys. Lett., vol. 86, no. 24, pp. 243 505-1-243 505-3, 2005.
6. M. Fukuda, Optical Semiconductor Device. New York: Wiley, 1999.
7. M. T. Sheen, C. M. Chang, H. C. Teng, J. H. Kuang, K. C. Hsieh, and W. H. Cheng, "The influence of thermal aging on joint strength and fracture surface of PbSn and AuSn solders in laser diode packages," J. Electron. Mater., vol. 31, no. 8, pp. 895-902, Aug. 2002.
8. M. T. Sheen, Y. H. Ho, C. L. Wang, K. C. Hsieh, and W. H. Cheng, "The joint strength and microstructure of fluxless Au/Sn solders in InP-based laser diode packages," J. Electron. Mater., vol. 34, no. 10, pp. 1318-1323, Oct. 2005.
9. G. Meneghesso, S. Levada, E. Zanoni, S. Podda, G. Mura, M. Vanzi, A. Cavallini, S. Du, and I. Eliashevich, "Failure modes and mechanisms of DC-aged GaN LEDs," Phys. Stat. Sol., vol. 194, no. 2, pp. 389-392, 2002.
10. G. Meneghesso, S. Levada, E. Zanoni, G. Scamarcio, G. Mura, S. Podda, M. Vanzi, A. Cavallim, A. Castaldini, S. Du, and I. Eliashevich, "Reliability of visible GaN LEDs in plastic package," Microelectron. Reliab., vol. 43, no. 9, pp. 1737-1742, Sep. 2003.
11. T. Yanagisawa and T. Kojima, "Long-term accelerated current operation of white light-emitting diodes," J. Lumin., vol. 114, no. 1, pp. 39-42, Jul. 2005.
12. MARC 6.3, User Guide, MARC Analysis Research Corporation, Palo Alto, CA, 1996, pp. 3.1-1-3.17-1.
13. MENTAL II, User Guide, MARC Analysis Research Corporation, Palo Alto, CA, 1996, pp. 6-1-6-26.