Strength and fracture analysis of silicon-based components for embedding

Journal of the European Ceramic Society

Volumn 31, Issue 4, 2011, Pages 549-558

  Deluca, Marco ^a,b   Bermejo, Raúl ^b   Pletz, Martin ^a,b   Supancic, Peter ^a,b   Danzer, Robert ^a,b  

^a MATERIALS CENTER LEOBEN FORSCHUNG GMBH   (Austria)

^b INSTITUT FÜR STRUKTUR UND FUNKTIONSKERAMIK   (Austria)

Author keywords

B. Failure analysis; C. Fracture; C. Strength; E. Functional applications; Printed circuit boards

Indexed keywords

B. FAILURE ANALYSIS; BIAXIAL LOADING; C. FRACTURE; C. STRENGTH; EMBEDDED COMPONENTS; FE-SIMULATION; FRACTOGRAPHIC ANALYSIS; FRACTURE ANALYSIS; FRACTURE BEHAVIOUR; FRACTURE LOAD; FUNCTIONAL APPLICATIONS; LOADING PROCESS; METAL CONTACTS; PURE SILICON; SI CHIPS; SILICON-BASED; SINGLE CRYSTALLINE SILICON; WEIBULL MODULUS;

FAILURE ANALYSIS; FRACTURE MECHANICS; METAL ANALYSIS; METALS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; QUALITY ASSURANCE; WEIBULL DISTRIBUTION;

FRACTURE;

EID: 78650308052     PISSN: 09552219     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jeurceramsoc.2010.10.029     Document Type: Article

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