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Volumn , Issue , 2010, Pages 885-890
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Silicon surface passivation by ultrathin Al2O3 films and Al2O3/SiNx stacks
a a a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
ALUMINUM OXIDES;
BELT-FURNACES;
CAPPING LAYER;
HIGHER EFFICIENCY;
P-TYPE SILICON WAFERS;
SILICON SURFACES;
SURFACE PASSIVATION;
SURFACE RECOMBINATION VELOCITIES;
THERMAL ALD;
THERMAL STABILITY;
ULTRA-THIN;
ATOMIC LAYER DEPOSITION;
BELT CONVEYORS;
PASSIVATION;
PHOTOVOLTAIC EFFECTS;
PLASMA DEPOSITION;
PLASMAS;
PULSED LASER DEPOSITION;
SEMICONDUCTING SILICON COMPOUNDS;
SILICON NITRIDE;
SILICON WAFERS;
THERMODYNAMIC STABILITY;
ALUMINUM;
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EID: 78650136492
PISSN: 01608371
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/PVSC.2010.5614132 Document Type: Conference Paper |
Times cited : (35)
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References (14)
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