Bonding strength of pressurized microchannels fabricated by polydimethylsiloxane and silicon

Journal of Micromechanics and Microengineering

Volumn 20, Issue 11, 2010, Pages

  Wu, Guan Wei ^a   Shih, Wen Pin ^a   Hui, Chung Yuen ^b   Chen, Sih Li ^a   Lee, Chi Yuan ^c  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b Cornell University ^*  (United States)

^c YUAN ZE UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ANALYTICAL MODEL; BEAM THEORIES; BONDING ENERGIES; BONDING INTERFACES; BONDING STRENGTH; CLOSED FORM; CRITICAL FLUID; CRITICAL PRESSURES; CURING TEMPERATURE; FINITE ELEMENT SIMULATIONS; FRACTURE MECHANICS APPROACH; POLYDIMETHYLSILOXANE PDMS; RELEASE RATE; SILICON MICROCHANNELS; WAFER BONDING TECHNIQUES;

COMPUTER SIMULATION; CURING; FINITE ELEMENT METHOD; FRACTURE MECHANICS; MATHEMATICAL MODELS; MICROCHANNELS; MODELS; PRESSURE; SILICON WAFERS; SILICONES;

WAFER BONDING;

EID: 78649755569     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/20/11/115032     Document Type: Article

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