Constitutive modeling on creep deformation for a SnPb-based composite solder reinforced with microsized Cu particles

Microelectronics Reliability

Volumn 50, Issue 12, 2010, Pages 2020-2025

  Shi, Yaowu ^a   Yan, Yanfu ^a   Liu, Jianping ^a   Xia, Zhidong ^a   Lei, Yongping ^a   Guo, Fu ^a   Li, Xiaoyan ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE SOLDERS; CONSTITUTIVE MODELING; CREEP DEFORMATION MECHANISMS; CREEP DEFORMATIONS; CREEP STRAIN; LOAD CREEP TESTS; SINGLE SPECIMEN; SN-37PB; SOLDER JOINTS; STEADY STATE CREEP RATE; STRESS EXPONENTS;

ACTIVATION ENERGY; CREEP; CREEP RESISTANCE;

PARTICLE REINFORCED COMPOSITES;

EID: 78649442442     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2010.07.008     Document Type: Article

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