Synthesis and cure kinetics of isotropic conductive adhesives comprising sub-micrometer sized nickel particles

Materials Science and Engineering: B

Volumn 117, Issue 2, 2005, Pages 153-158

  Goh, C F ^a   Yu, H ^a   Yong, S S ^a   Mhaisalkar, S G ^a   Boey, F Y C ^a   Teo, P S ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Cure kinetics; Isotropic conductive adhesives; Nickel particles

Indexed keywords

CHARACTERIZATION; DIFFERENTIAL SCANNING CALORIMETRY; DIFFRACTOMETERS; ELECTRIC CONDUCTIVITY; ELECTRONICS PACKAGING; GLASS TRANSITION; HYDROTHERMAL SYNTHESIS; NICKEL DEPOSITS; REACTION KINETICS; SCANNING ELECTRON MICROSCOPY; SUPERCONDUCTING TRANSITION TEMPERATURE; X RAY DIFFRACTION;

CURE KINETICS; ELECTRICALLY CONDUCTIVE ADHESIVES (ECA); ISOTROPIC CONDUCTIVE ADHESIVES; NICKEL PARTICLES;

ADHESIVES;

EID: 13544262321     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2004.11.007     Document Type: Article

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