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Volumn 51, Issue 10, 2010, Pages 1759-1763
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Effect of formic acid surface modification on bond strength of solid-state bonded interface of tin and copper
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Author keywords
Bonding; Copper; Formic acid; Interface; Strength; Surface modification; Tin
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Indexed keywords
BASE METALS;
BOND INTERFACE;
BOND STRENGTH;
BONDED INTERFACE;
BONDED JOINT;
BONDING PRESSURE;
BONDING TEMPERATURES;
BONDING TIME;
COPPER SURFACE;
DEFORMABILITY;
FRACTURED SURFACES;
INTERFACE;
INTERFACIAL MICROSTRUCTURE;
LOW TEMPERATURES;
METALLIC TIN;
SEM OBSERVATION;
SOLID STATE BONDING;
STRENGTH;
SURFACE MODIFICATION;
VACUUM CHAMBERS;
BOND STRENGTH (MATERIALS);
COPPER;
FORMIC ACID;
OXIDE FILMS;
TIN;
TENSILE STRENGTH;
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EID: 78649378103
PISSN: 13459678
EISSN: None
Source Type: Journal
DOI: 10.2320/matertrans.MJ201019 Document Type: Article |
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Times cited : (23)
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References (13)
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