Behavior of plated microbumps during ultrasonic flip-chip bonding determined from dynamic strain measurement

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 42, Issue 4 B, 2003, Pages 2193-2197

  Watanabe, Naoya ^a   Asano, Tanemasa ^a  

^a KYUSHU INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Au plated microbump; Bonding behavior; Electronic packaging; Strain gauge array; Three dimensional packaging; Ultrasonic flip chip bonding

Indexed keywords

BONDING; DEFORMATION; ELECTRONICS PACKAGING; FRICTION; GOLD; PRESSURE EFFECTS; STRAIN GAGES; STRAIN MEASUREMENT; THREE DIMENSIONAL; ULTRASONICS;

BONDING BEHAVIOR; FLIP CHIP BONDING; GOLD PLATED MICROBUMP; THREE DIMENSIONAL PACKAGING;

FLIP CHIP DEVICES;

EID: 0037672007     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.42.2193     Document Type: Article

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