Low-temperature direct bonding of flip-chip mountable VCSELs with Au-Au surface activation

IEEJ Transactions on Sensors and Micromachines

Volumn 128, Issue 6, 2008, Pages

  Imamura, Teppei ^a   Higurashi, Eiji ^b   Suga, Tadatomo ^a   Sawada, Renshi ^c  

^a UNIVERSITY OF TOKYO   (Japan)

^b UNIVERSITY OF TOKYO   (Japan)

^c KYUSHU UNIVERSITY   (Japan)

Author keywords

Flip chip bonding; Hybrid integration; Low temperature bonding; Surface activated bonding; VCSEL

Indexed keywords

AMBIENT AIR; AU SURFACES; BONDING TEMPERATURES; CONTACT LOAD; CURRENT VOLTAGE; DIRECT BONDING; FLIP CHIP; FLIP-CHIP BONDING; HYBRID INTEGRATION; I-V MEASUREMENTS; LIGHT INTENSITY; LOW TEMPERATURE BONDING; LOW TEMPERATURES; OPTOELECTRONIC CHARACTERISTICS; ORGANIC CONTAMINANT; RADIO FREQUENCY PLASMA; SHEAR FORCE; SILICON SUBSTRATES; STATIC PRESSURE; SURFACE ACTIVATION; VERTICAL-CAVITY SURFACE EMITTING LASER;

ARGON; CURRENT VOLTAGE CHARACTERISTICS; DIES; FLIP CHIP DEVICES; LASERS; SHEAR STRENGTH; SURFACE EMITTING LASERS;

BONDING;

EID: 73849107493     PISSN: 13418939     EISSN: 13475525     Source Type: Journal    
DOI: 10.1541/ieejsmas.128.266     Document Type: Article

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