Low-temperature bonding of laser diode chips on silicon substrates using plasma activation of Au films

IEEE Photonics Technology Letters

Volumn 19, Issue 24, 2007, Pages 1994-1996

  Higurashi, Eiji ^a   Imamura, Teppei ^b   Suga, Tadatomo ^b   Sawada, Renshi ^c  

^a UNIVERSITY OF TOKYO   (Japan)

^b UNIVERSITY OF TOKYO   (Japan)

^c KYUSHU UNIVERSITY   (Japan)

Author keywords

Flip chip bonding; Hybrid integration; Low temperature bonding

Indexed keywords

FLIP CHIP DEVICES; GOLD; PLASMA APPLICATIONS; SILICON; SUBSTRATES; SURFACE EMITTING LASERS;

DIE-SHEAR STRENGTH; LOW-TEMPERATURE BONDING; STATIC PRESSURE;

SEMICONDUCTOR LASERS;

EID: 36849000258     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/LPT.2007.908642     Document Type: Article

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