Effect of formic acid surface modification: On bond strength of solid-state bonded interface of tin

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Volumn 73, Issue 10, 2009, Pages 809-815

  Koyama, Shinji ^a   Oya, Issei ^a  

^a GUNMA UNIVERSITY   (Japan)

Author keywords

Bond strength; Formic acid; Solid state bonding; Surface modification; Tin

Indexed keywords

BASE METALS; BOND STRENGTH; BONDED INTERFACE; BONDED JOINT; BONDING PRESSURE; BONDING TEMPERATURES; BONDING TIME; DISTRIBUTION DENSITY; FRACTURED SURFACES; INTERFACIAL MICROSTRUCTURE; INTERFACIAL REGION; JOINT STRENGTH; SEM OBSERVATION; SOLID STATE BONDING; SURFACE MODIFICATION; VACUUM CHAMBERS;

BOND STRENGTH (MATERIALS); CHEMICAL FINISHING; ELECTROLYSIS; ELECTROLYTIC POLISHING; ORGANIC ACIDS; SURFACE TREATMENT; TIN;

FORMIC ACID;

EID: 72149104751     PISSN: 00214876     EISSN: None     Source Type: Journal    
DOI: 10.2320/jinstmet.73.809     Document Type: Article

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