Al-Cu pattern wafer study on metal corrosion due to chloride ion contaminants

IEEE Transactions on Semiconductor Manufacturing

Volumn 23, Issue 4, 2010, Pages 553-558

  Wu, Bi Jun ^a   Bai, Hsunling ^a   Lin, I Kai ^a   Liu, S S ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Airborne molecular contaminants (AMCs); chloride contamination; cleanroom microcontamination; HCl; pattern wafer; semiconductor device

Indexed keywords

AIRBORNE MOLECULAR CONTAMINANTS; AIRBORNE MOLECULAR CONTAMINATION; CHLORIDE CONTAMINATION; CHLORIDE IONS; CLEANROOM ENVIRONMENT; EXPOSURE TESTS; HCL; ION MOBILITY SPECTROMETER; METAL CORROSION; PATTERN WAFER; SCANNING ELECTRONS; WAFER SURFACE;

CHLORINE COMPOUNDS; CLEAN ROOMS; CONTAMINATION; CORROSION; ION CHROMATOGRAPHY; IONS; LABORATORIES; METALS; PREVENTIVE MAINTENANCE; SCRAP METAL; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR SWITCHES; SPECTROMETERS; SURFACE DEFECTS; X RAY SPECTROSCOPY;

SILICON WAFERS;

EID: 78149246827     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2010.2061972     Document Type: Article

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