Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate

Journal of Materials Research

Volumn 25, Issue 2, 2010, Pages 303-314

  Zhang, QingKe ^a   Zou, HeFei ^a   Zhang, Zhe Feng ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE STRENGTH; CU SUBSTRATE; FATIGUE LIFE; FATIGUE LOADINGS; FATIGUE RESISTANCE; FRACTURE MECHANISMS; INTERFACIAL REACTIONS; SOLDER JOINTS; TENSILE AND FATIGUE PROPERTIES;

EMBRITTLEMENT; FATIGUE OF MATERIALS; SILVER; ZINC;

TIN;

EID: 77957970750     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2010.0035     Document Type: Conference Paper

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