Fluxless process of producing In-Au joints on copper substrates

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 278-282

  So, William W ^a   Lee, Chin C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CHROMIUM; COPPER; DEPOSITION; ENERGY DISPERSIVE SPECTROSCOPY; GOLD; INDIUM ALLOYS; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SOLDERING; SUBSTRATES; WELDS;

FLUXLESS BONDING TECHNIQUE; INDIUM GOLD ALLOY; SCANNING ACOUSTIC MICROSCOPE; SOLDERS;

ELECTRONICS PACKAGING;

EID: 0032667377     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (15)