Barrier metallization technique on copper substrates for soldering applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 855-860

  So, William W ^a   Choe, Selah ^a   Chuang, Ricky ^a   Lee, Chin C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ENERGY DISPERSIVE SPECTROSCOPY; INDIUM ALLOYS; METALLIZING; PHASE DIAGRAMS; SCANNING ELECTRON MICROSCOPY; SOLDERING; SUBSTRATES;

BARRIER METALLIZATION TECHNIQUE; OXIDATION FREE FLUXLESS TECHNOLOGY; SCANNING ACOUSTIC MICROSCOPE;

ELECTRONICS PACKAGING;

EID: 0034482529     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (20)