Alloy joints for high temperature electronic packaging

Materials Research Society Symposium - Proceedings

Volumn 515, Issue , 1998, Pages 91-97

  So, William W ^a   Lee, Chin C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC MICROSCOPES; BINARY ALLOYS; ENERGY DISPERSIVE SPECTROSCOPY; HIGH TEMPERATURE PROPERTIES; INDIUM ALLOYS; INTERDIFFUSION (SOLIDS); METAL MELTING; METALLOGRAPHIC MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; STRESS ANALYSIS; THERMAL EXPANSION; THERMAL STRESS;

ALLOY JOINTS; SCANNING ACOUSTIC MICROSCOPE (SAM);

ELECTRONICS PACKAGING;

EID: 0031630317     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-515-91     Document Type: Conference Paper

References (15)