Role of different additives on silicon dioxide film removal rate during chemical mechanical polishing using ceria-based dispersions

Journal of the Electrochemical Society

Volumn 157, Issue 9, 2010, Pages

  Dandu, P R Veera ^a   Peethala, B C ^a   Babu, S V ^a  

^a Clarkson University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LIMITING VALUES; REACTIVE SPECIES; REMOVAL RATE; SILICON DIOXIDE; SILICON DIOXIDE FILM;

ABRASIVES; ADDITIVES; ADSORPTION; CERIUM COMPOUNDS; CHEMICAL MECHANICAL POLISHING; CHEMICAL POLISHING; DISPERSIONS;

SILICA;

EID: 77955790904     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3457387     Document Type: Article

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