The effect of hydrogen peroxide on polishing removal rate in CMP with various abrasives

Applied Surface Science

Volumn 255, Issue 6, 2009, Pages 3764-3768

  Manivannan, R ^a   Ramanathan, S ^a  

^a INDIAN INSTITUTE OF TECHNOLOGY MADRAS   (India)

Author keywords

Abrasives; Additives; Chemical mechanical planarization; Selectivity; Shallow trench isolation

Indexed keywords

ADDITIVES; ALUMINA; ALUMINUM OXIDE; CATALYST SELECTIVITY; CERIUM OXIDE; CHEMICAL MECHANICAL POLISHING; HYDROGEN PEROXIDE; NITRIDES; OXIDATION; PEROXIDES; POLISHING; SILICA; SILICON CARBIDE; SILICON NITRIDE; TITANIUM DIOXIDE; ZIRCONIA;

ABRASIVE PARTICLES; EFFECT OF HYDROGEN; NITRIDE SURFACE; REMOVAL RATE; SHALLOW TRENCH ISOLATION; TITANIA;

ABRASIVES;

EID: 57849091385     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2008.10.040     Document Type: Article

References (29)

1. Steigerwald J.M., Murarka S.P., and Gutmann R.J. Chemical Mechanical Planarization of Microelectronic Materials (1997), John Wiley & Sons, New York p. 2
2. Zantye P.B., Kumar A., and Sikder A.K. Mater. Sci. Eng. R 45 (2004) 89
3. Oliver M.R. Chemical Mechanical Planarization of Semiconductor Materials (2004), Springer, New York p. 1
4. Chandrasekaran N. Mater. Res. Soc. Symp. Proc. 816 (2004) K 9.2.1
5. Cook L.M. J. Non-Cryst. Solids 120 (1990) 152
6. Jiang M., Wood N.O., and Komanduri R. Wear 220 (1998) 59
7. Kilbourn B.T., and Cerium. A Guide to Its Role in Chemical Technology (1992), Molycorp. Inc., Mountainpass, CA, USA p. 25
8. Hoshino T., Kurata Y., Terasaki Y., and Susa K. J. Non-Cryst. Solids 283 (2001) 129
9. Suphantharida P., and Osseo-Asare K. J. Electrochem. Soc. 151 10 (2004) G658
10. Abiade J.T., Yeruva S., Choi W., Moudgil B.M., Kumar D., and Singh R.K. J. Electrochem. Soc. 153 11 (2006) G1001
11. America W.G., and Babu S.V. Electrochem. Solid-State Lett. 7 12 (2004) G327
12. Carter P.W., and Johns T.P. Electrochem. Solid-State Lett. 8 8 (2005) G218
13. R. Srinivasan, S.V. Babu, W.G. America, Y.-S. Her, US Patent 6,468,910 (2002).
14. Katoh T., Kang H.-G., Paik U., and Park J.-G. Jpn. J. Appl. Phys. Part I 3 42 (2003) 1150
15. Kim S.-K., Lee S., Paik U., Katoh T., and Park J.-G. J. Mater. Res. 18 9 (2003) 2163
16. Park J.-G., Katoh T., Park J.-H., Paik U., and Kwack K.-D. Rare Metals 21 (2002) 6
17. Nagendra Prasad Y., and Ramanathan S. Electrochem. Solid-State Lett. 9 (2006) G337
18. Hariharaputhiran M., Zhang J., Ramarajan S., Keleher J.J., Li Y., and Babu S.V. J. Electrochem. Soc. 147 (2000) 3820
19. Aksu S., and Doyle F.M. J. Electrochem. Soc. 149 (2002) B340
20. Du T., Vijayakumar A., and Desai V. Electrochim. Acta 49 (2004) 4505
21. Tsai T.-H., Wu Y.-F., and Yen S.-C. Appl. Surf. Sci. 214 (2003) 120
22. W.R. Morrison, K.P. Hunt, European Patent 0853335 (1998).
23. Iler R.K. The Chemistry of Silica (1979), John Wiley and Sons, New York p. 65
24. Zeglinski J., Piotrowski G.P., and Piekos R. J. Mol. Struct. 794 (2006) 83
25. Hu Y.-Z., Gutmann R.J., and Chow T.P. J. Electrochem. Soc. 145 11 (1998) 3919
26. Osseo-Asare K. J. Electrochem. Soc. 149 12 (2002) G651
27. Gilliss S.R., Bentley J., and Carter C.B. Appl. Surf. Sci. 241 (2005) 61
28. Pourbaix M. Atlas of Electrochemical Equilibria in Aqueous Solutions (1974), NACE, Houston, USA p. 197
29. Wang L., Zhang K., Song Z., and Feng S. Appl. Surf. Sci. 253 (2007) 4951