Advanced electronic packaging materials

Advanced Materials and Processes

Volumn 163, Issue 10, 2005, Pages 33-37

  Zweben, Carl ^a  

^a Composites and Advanced Thermal Management Materials Consultant ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON CARBON COMPOSITES; CERAMIC MATRIX COMPOSITES; FAILURE (MECHANICAL); METALLIC MATRIX COMPOSITES; MICROELECTRONICS; NONMETALLIC MATRIX COMPOSITES; OPTOELECTRONIC DEVICES; PACKAGING MATERIALS; THERMAL CONDUCTIVITY; THERMAL EXPANSION; THERMAL STRESS;

ELECTRONIC PACKAGING MATERIALS; MONOLITHIC CARBONACEOUS MATERIALS; POLYMER MATRIX COMPOSITES; THERMAL EXPANSION COEFFICIENT;

ELECTRONICS PACKAGING;

EID: 28344440695     PISSN: 08827958     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (0)