Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrate

Soldering and Surface Mount Technology

Volumn 16, Issue 2, 2004, Pages 21-26

  Yan, Eric C C ^a   Lee, S W Ricky ^a   Huang, X ^b  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b Hon Hai Precision Industry   (Taiwan)

Author keywords

Product reliability; Semiconductor technology; Shear strength; Solders

Indexed keywords

AGING OF MATERIALS; ELECTROLYSIS; METALLIZING; NICKEL PLATING; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SUBSTRATES; SURFACE MOUNT TECHNOLOGY;

BUMP METALLIZATION; SHEAR TESTING; SOLDER BALLS; THERMAL AGING;

SOLDERING ALLOYS;

EID: 2942541226     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910410537318     Document Type: Article

References (7)

1. Bradley, E. and Banerji, K. (1996), "Effect of PCB finish on the reliability and wettability of ball grid array packages", IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, Vol. 19 No. 2, pp. 320-30.
2. Fang, J.L., Ye, X.R. and Fang, J. (1992), "Factors influencing solderability of electroless Ni-P deposits", Plating and Surface Finishing, pp. 44-7.
3. Lau, J.H. (1995), Ball Grid Array Technology, McGraw-Hill, New York, NY.
4. Lau, J.H. and Pao, Y.H. (1997), Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies. McGraw-ffill, New York, NY.
5. Martyak, N.M. and McCaskie, I.E. (1996), "Speciation in electroless nickel solutions", Plating and Surface Finishing, pp. 62-6.
6. Parker, K. (1987), "The formulation of electroless nickel-phosphorus plating baths", Plating and Surface Finishing, pp. 60-5.
7. Tai, S.F., Ourdjini, A., Khong, Y.L., Venkatesh, V.C. and Tamin, M.N. (2002), "Effect of phosphorus content and solid state aging on intermetallic formation between lead-free Sn-Ag-Cu solder and electroless nickel/immersion gold under bump metallurgy", Proc. 4th International Symposium on Electronic Materials and Packaging, Kaohsiung, Taiwan, ROC, pp. 267-70.