Thermal conductivity measurements on polycrystalline silicon microbridges using the 3ω technique

Journal of Heat Transfer

Volumn 131, Issue 4, 2009, Pages 1-8

  Hopkins, Patrick E ^a,b   Phinney, Leslie M ^b  

^a University of Virginia   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

3 technique; Polycrystalline silicon; Suspended microbridge; Thermal boundary resistance; Thermal conductivity

Indexed keywords

BOND PAD; CHARACTERISTIC SIZE; CONSTITUENT MATERIALS; ELECTRICAL CONTACTS; EXPERIMENTAL DETERMINATION; EXPERIMENTAL METHODS; GEOMETRICAL DESIGNS; JOULE-HEATING TECHNIQUE; MICRO ELECTRO MECHANICAL SYSTEM; MICRO-BRIDGE; MICROBRIDGES; POLY-CRYSTALLINE SILICON; SANDIA NATIONAL LABORATORIES; STEADY STATE; SURFACE MICROMACHINING PROCESS; SUSPENDED MICROBRIDGE; TEST STRUCTURE; THERMAL BOUNDARY RESISTANCE; THERMAL CONDUCTIVITY MEASUREMENTS; THERMAL PERFORMANCE; THERMAL PROPERTIES; THERMAL RESISTANCE;

COMPOSITE MICROMECHANICS; HEATING; MEMS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; THERMAL CONDUCTIVITY; THERMOANALYSIS;

POLYSILICON;

EID: 77955240752     PISSN: 00221481     EISSN: 15288943     Source Type: Journal    
DOI: 10.1115/1.3072907     Document Type: Article

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