Bond pad effects on steady state thermal conductivity measurement using suspended micromachined test structures

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 11, Issue , 2007, Pages 561-568

  Phinney, Leslie M ^a   Piekos, Edward S ^a   Kuppers, Jaron D ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HEATING; JOULE HEATING; NANOSYSTEMS;

CONSTANT TEMPERATURE; CORRECTION FACTORS; ELECTRICAL RESISTANCES; HEAT SINK TEMPERATURE; JOULE HEATING EFFECT; MICRO-MACHINED; STEADY-STATE RESISTANCES; THERMAL CONDUCTIVITY MEASUREMENTS;

THERMAL CONDUCTIVITY;

EID: 84928594728     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE200741349     Document Type: Conference Paper

References (21)

1. Goodson, K. E., and Flik, M. I., 1994, "Solid Layer Thermal-Conductivity Measurement Techniques," Applied Mechanics Reviews, 47, pp. 101-112.
2. Borca-Tasciuc, T., and Chen, G., 2004, "Experimental Techniques for Thin-Film Thermal Conductivity Characterization," in Thermal Conductivity: Theory, Properties, and Applications, edited by T. M. Tritt, Kluwer Academic/Plenum Publishers, New York, pp. 205-237.
3. Cahill, D. G., 1990, "Thermal Conductivity Measurement from 30 to 750K: the 3? Method," Review of Scientific Instruments, 61, pp. 802-808.
4. Dames, C., and Chen, G., 2005, "1, 2, and 3 Methods for Measurements of Thermal Properties," Review of Scientific Instruments, 76, pp. 124902-1-124902-14.
5. Tai, Y. C., Mastrangelo, C. H., and Muller, R. S., 1988, "Thermal Conductivity of Heavily Doped Low-Pressure Chemical Vapor Deposited Polycrystalline Silicon Films," Journal of Applied Physics, 63, pp. 1442-1447.
6. Asheghi, M., Touzelbaev, M. N., Goodson, K. E., Leung, Y. K., and Wong, S. S., 1998, "Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates," Journal of Heat Transfer, 120, pp. 30-36.
7. Asheghi, M., Kurabayashi, K., Kasnavi, R., and Goodson, K. E., 2002, "Thermal Conduction in Doped Single-Crystal Silicon Films," Journal of Applied Physics, 91, pp. 5079-5088.
8. Shojaei-Zadeh, S., Zhang, S., Liu, W., Yang, Y., Sadeghipour, S. M., and Asheghi, M., 2004, "Thermal Characterization of Thin Film Cu Interconnects for the Next Generation of Microelectronic Devices," ITherm 2004 Proceedings, Las Vegas, Nevada, pp. 575-583.
9. von Arx, M., Paul, O., and Baltes, H., 2000, "Process-Dependent Thin-Film Thermal Conductivities for Thermal CMOS MEMS," Journal of Microelectromechanical Systems, 9, pp. 136-145.
10. Paul, O. M., Korvink, J., and Baltes, H., 1994, "Determination of the Thermal Conductivity of CMOS IC Polysilicon," Sensors and Actuators A, 41-42, pp. 161-164.
11. Jansen, E., and Obermeier, E., 1996, "Thermal Conductivity Measurements on Thin Films Based on Micromechanical Devices," Journal of Micromechanics and Microengineering, 6, pp. 118-121.
12. McConnell, A. D., Uma, S., and Goodson, K. E., 2001, "Thermal Conductivity of Doped Polysilicon Layers," Journal of Microelectromechanical Systems, 10, pp. 360-369.
13. Graham, S., Olson, B., Wong, C., Piekos, E., McConnell, A., and Goodson, K. E., 2003, "The Effects of Processing Conditions on the Thermal Conductivity of Polycrystalline Silicon Films," Proceedings of IMECE '03, IMECE03-42091, Washington, D.C., pp. 1-5.
14. Yang, Y., White, R. W., and Asheghi, M., 2006, "Thermal Characterization of Cu/CoFe Multilayer for Giant Magnetoresistive Head Applications," Journal of Heat Transfer, 128, pp. 113-120.
15. Reifenberg, J., England, Voss, R.J., Rao, P., Schmitt, W., Yang, Y., Shojaei-Zadeh, S., Liu, W., Sadeghipour, S. M., and Asheghi, M., 2003, "Thermal Conductivity Measurements of Thin Aluminum Layers Using Steady State Joule Heating and Electrical Resistance Thermometry in Suspended Bridges," Proceedings of IMECE '03, IMECE03-42055, Washington, D.C., pp. 1-4.
16. Yang, Y., and Asheghi, M., 2004, "A Novel Technique for In-Plane Thermal Conductivity Measurements of Electrically Conductive Interconnects and Nanostructures," ITherm 2004 Proceedings, Las Vegas, Nevada, pp. 564-569.
17. Sniegowski, J. J., and de Boer, M. P., 2000, "ICCompatible Polysilicon Surface Micromachining," Annual Review of Material Science, 30, pp. 299-333.
18. "SUMMiT VTM: Five Level Surface Micromachining Technology Design Manual," SAND2007-0446, MEMS Technologies Department, Sandia National Laboratories, Albuquerque, New Mexico, 2007.
19. Incropera, F. P., and DeWitt, D. P., 2002, Fundamentals of Heat and Mass Transfer, 5th edition, John Wiley & Sons, New York.
20. Phinney, L. M., J. D. Kuppers, and R. C. Clemens, "Thermal Conductivity of SUMMiTTM V Polycrystalline Silicon," SAND2006-7112, Sandia National Laboratories, Albuquerque, New Mexico, November 2006.
21. "Calore: A Computational Heat Transfer Program," SAND2006-6083P, Calore Development Team, Sandia National Laboratories, Albuquerque, New Mexico, Technical Report, October 5, 2006.