Advances in thermal interface technology: Mono-metal interconnect formation, processing and characterisation

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

Volumn , Issue , 2010, Pages

  Wunderle, B ^a,b   Klein, M ^a   Dietrich, L ^a   Abo Ras, M ^c   Mrossko, R ^c   May, D ^a   Schacht, R ^a,d   Oppermann, H ^a   Michel, B ^a   Reichl, H ^a  

^a FRAUNHOFER IZM   (Germany)

^b CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

^c BERLINER NANOTEST UND DESIGN GMBH   (Germany)

^d Lausitz University of Applied Sciences   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERISATION; ENHANCED SURFACE; HIGH-POWER; INTERFACE TECHNOLOGY; NEW PROCESS; TECHNOLOGICAL ADVANCES; TEST STANDS; THERMAL CHARACTERISATION; THERMAL INTERFACES; THERMAL RESISTANCE; THERMAL SOLUTION; THERMAL TECHNOLOGIES; THERMO COMPRESSION BONDING;

ELECTRONICS ENGINEERING; POWER ELECTRONICS; SILVER;

ELECTRONICS INDUSTRY;

EID: 77955196060     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2010.5501343     Document Type: Conference Paper

References (18)

1. R. Viswanath, V. Wakharkar, A. Watwe and V. Lebonheur. Thermal Performance Requirements from Silicon to Systems. Intel Technology Journal Q3, pp. 1-16, 2000.
2. S.V. Garimella, Y.K. Joshi, A. Bar-Cohen, R. Mahajan, K.C. Toh, V.P. Baelmans, J. Lohan, B. Sammakia, and F. Andros. Thermal challenges in next generation electronic systems - summary of panel presentations and discussions. IEEE Trans. Components and Packaging Technologies, 25(4), pp. 569-575, 2002.
3. Liu, Y., S. Irving, T. Luk, and D. Kinzer. Trends of Power Electronics Packaging and Modeling. Proc. 10th EPTC, 2008.
4. M. Rencz. Testing interface thermal resistance, Proc. 9th EPTC, 2007.
5. R. Schacht, D. May, B. Wunderle, O. Wittler, A. Gollhardt, B. Michel and H. Reichl. Characterization of Thermal Interface Materials to Support Thermal Simulation. Proc. 12th Therminic 2006, Sep 27-29, Nice, Côte d'Azur, France, 2006.
6. th Therminic 2008, Rome, Sept 24-26 2008
7. th Itherm Conf. 2008.
8. A. Devos, J.-F. Robillard, R. Côte et P. Emery. High Laser-Wavelength Sensitivity of the Picosecond Ultrasonic Response in Transparent Thin Films, Physical Review B 74, 6, 064114, 2006
9. R. J. Linderman, T. Brunschwiler, U. Kloter, H. Toy, B. Michel, Hierarchical Nested Surface Channels for Reduced Particle Stacking and Low-Resistance Thermal Interfaces, Proc. 23st IEEE SEMI-THERM Symp., 2007, pp. 87-94.
10. D.F. Rae and P. Borgesen. Optimising the automated assembly process for filled polymer-based themal bondlines. APEX 2009.
11. B. Wunderle and B. Michel. Lifetime Modeling for Microsystems Integration - from Nano to Systems. J. of Microsystem Technologies, Vol 15, No 6, pp 799.813, Juni 2009
12. B. Wunderle, K.-F. Becker, R. Sinning, O. Wittler, R. Schacht, H. Walter, M. Schneider-Ramelow, K. Halser, N. Simper, B. Michel and H. Reichl. Thermo-Mechanical Reliability during Technology Development of Power Chipon-Board Assemblies with Encapsulation. J. Microsystem Technologies, 2009, DOI :10.1007/s00542-009-0907-1
13. Standard Test Method for Thermal Transmission Properties of Thermally Conductive Electrical Insulation Materials. ASTM Standard D-5470-06, Copyright ASTM International, Conshohocken, PA, 2007.
14. L.H. Qian, X.Q. Yan, T. Fujita, A. Inoue and M.W. Chen. Surface enhanced Raman scattering of nanoporous Gold: Smaller pore sizes stronger enhancements. Applied Physics Letters 90, 153120, 2007
15. X. Lu, T.J. Balk, R. Spolenak and E. Arzt. Dealloying of Au-Ag thin films with a composition gradient: Influence on morphology of nanoporous Au. Thin Solid Films 515, pp. 7122-7126, 2007
16. A. Hodge, J. Biener, J. Hayes, P. Bythrow, C. Volkert, A. Hamza Scaling equation for yield strength of nanoporous open-cell foams. Acta Materialia, Volume 55, Issue 4, Pages 1343-1349, 2007
17. O. Wittler, H. Walter, R. Dudek, W. Faust, W. Jun and B. Michel. Deformation and Fatigue Behaviour of AuSn Interconnects. Proc. EPTC, 2006
18. th EuroSimE Conf. 2009.