Characterisation and modelling of the nanoindentation experiment in AU layers

2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

Volumn , Issue , 2009, Pages

  Wittler, Olaf ^a   MroBko, Raul ^b   Huber, Saskia ^a   Gollhardt, Astrid ^a   Michel, Bernd ^a  

^a FRAUNHOFER IZM   (Germany)

^b AMIC Angewandte Micro Messtechnik GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERISATION; DATA SETS; ELASTIC-PLASTIC MATERIAL; FINITE ELEMENT SIMULATIONS; FINITE-ELEMENT MODELS; FITTING MODEL; FORCE-DISPLACEMENT CURVES; GOLD LAYER; METAL LAYER; NANOINDENTATION EXPERIMENTS; PLASTIC PROPERTY; SUBSTRATE EFFECTS; YOUNG'S MODULUS;

CURVE FITTING; ELASTIC MODULI; ELASTICITY; EXPERIMENTS; MICROELECTRONICS; MICROSYSTEMS; NANOINDENTATION; PLASTICS; RELIABILITY ANALYSIS; SIMULATORS; STRESS-STRAIN CURVES;

FINITE ELEMENT METHOD;

EID: 67650553625     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2009.4938492     Document Type: Conference Paper

References (13)

1. Wunderle, B., Mroßko, R., Kaulfersch, E., Wittler, O., Ramm, P., Michel, M. and Reichl, H., "Thermo-Mechanical Reliability of 3D-Integrated Structures in Stacked Silicon" Proc. MRS Fall Meeting, Boston, USA, Nov. 2006.
2. Oliver, W.C. and Pharr, G.M., "An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments", J. Mater. Res., vol. 7, no. 3 (1992), pp. 613-617.
3. Schwaiger R., Kraft O., "Analyzing the mechanical behavior of thin films using nanoindentation, cantilever microbeam deflection and finite element modeling", J. Mater. Res., Vol. 19, No. 1 (2004), pp. 315-324
4. Wittler O., Mroßko R., Kaulfersch E., Wunderle B., Michel B., "Mechanical characterisation of thin metal layers by modelling of the nanoindentation experiment", Proc. 2nd Electronics System-Integration Technology Conf. ESTC, London, Great Britain, Sept. 2008, pp. 995-998
5. Wymysłowski A., Wittler O., Mroßko R., Dudek R.; "Application of nanoindentation technique in microelectronics", Proc. 32nd International Microelectronics and Packaging IMAPS-CPMT Poland Conf., Warszawa-Pultusk, Poland, Sept. 2008
6. Fischer-Cripps, A. C., Nanoindentation, Springer-Verlag (New York, 2002), pp. 100-102.
7. Chudoba, T., Griepentrog, M., Dück, A., Schneider, D., Richter, F., "Young's modulus measurements on ultra-thin coatings", J. Mater. Res., Vol. 19, No. 1 (2004), pp. 301-314
8. Oliver, W.C., Pharr, G.M., "Measurement of hardness and elastic modulus by instrumented indentation: Advances in understanding and refinements to methodology", J. Mater. Res., Vol. 19, No. 1 (2004), pp. 3-20.
9. Alkorta, J., Martínez-Esnaola, J.M. and Gil Sevillano, J., "Absence of one-to-one correspondence between elastoplastic properties and sharp-indentation load-penetration data", J. Mater. Res., Vol. 20, No. 2 (2005), pp. 432-437
10. Pelletier H., Krier, J., Cornet, A., Mille P., "Limits of using bilinear stress]strain curve for finite element modeling of nanoindentation response on bulk materials", Thin Solid Films, vol. 379 (2000), pp. 147-155 (Pubitemid 32071385)
11. th EuroSimE Conf. , Delft, Netherlands, April, 2009
12. Pelletier, H., "Predictive model to estimate the stress-strain curves of bulk metals using nanoindentation", Tribology International, vol. 39 (2006), pp. 593-606
13. Giannuzzi, L. A. and Stevie F. A., Introduction to Focused Ion Beams, Springer (New York, 2004)